CHAMPAIGN, IL, United States (UPI) -- U.S. scientists report developing technology that allows the integration of dissimilar classes of semiconductor devices on a single substrate.

Frederick Seitz Materials Research Laboratory scientists at the University of Illinois-Champaign say the new technology permits either a one- or three-dimensional layout.

The approach uses specialized rubber 'stamps' with functional 'inks' consisting of high performance semiconductor materials in the form of micro and nanoscale ribbons, wires, tubes and bars.

A printing operation delivers the materials to virtually any type of substrate, including lightweight, flexible plastic sheets. The researchers say circuits built in such a manner offer electrical and mechanical attributes that would be impossible to achieve using conventional, wafer-based approaches to electronics.

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